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Technical Talk on Advanced Substrate and PCB for High Frequency and High Speed Applications
MTT-S Tainan Chapter Technical Speech
1.Introduction to Unimicron
2.Advanced Substrates and PCBs
lTechnology roadmap
3.Key Technologies and Challenges
4.Thermal Management
5.Summary
Date and Time
- Date: 30 Oct 2020
- Time: 01:30 PM to 04:00 PM
- All times are ROC
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Location
Physical Presentation and Discussion
- National Chung Cheng University
- No.168, Sec. 1, University Rd., Minhsiung,
- ChiaYi County
- Taiwan 621301
- Building: Innovation Building
- Room Number: Conference Hall, College of Engineering
- Click here for Map
Hosts
- Tainan Section Chapter, MTT17
- Co-sponsored by Department of Electrical Engineering, Department of Communications Engineering, Advanced institute of manufacturing with high-tech innovations (aim-hi), Center for Telcommunication Research, National Chung Cheng University
Speakers
Dr. WANG, JIN-SHENG of Unimicron Technology Corp.
Topic:
Advanced Substrate and PCB for High Frequency and High Speed Applications
Agenda
30 Oct 2020 01:30 PM ~ 30 Oct 2020 01:30 PM Academic Speech & Discussion
IEEE MTT-S TainanChapter, Department of Electrical Engineering, Department of Communications Engineering, Advanced institute of manufacturing with high-tech innovations (aim-hi), Center for Telcommunication Research, National Chung Cheng University
國立中正大學通訊工程系、國立中正大學電機工程系、國立中正大學電信研究中心、前瞻製造系統頂尖研究中心
