CFP:IEEE iSES 2020 - SUBMISSION DEADLINE: JULY 31, 2020
Greetings from IEEE iSES 2020 organizing committee!
Important Note on COVID-19 Situation
The IEEE iSES-2020 organizing committee recognizes the global emergency due to Coronavirus disease (COVID-19). In the unlikely scenario that the current situation prolongs, iSES-2020 will allow virtual presentations like Skype, recorded PPT, YouTube video, etc. as replacement of actual in-person presentation for authors who cannot travel to Chennai, India. All the accepted papers registered and presented either in-person or virtually will appear in the iSES-2020 proceedings and IEEE Xplore. We will continue to monitor the situation and update you as the things change significantly.
CALL FOR PAPERS: IEEE iSES 2020 - SUBMISSION DEADLINE: JULY 31, 2020
6th IEEE INTERNATIONAL SYMPOSIUM ON SMART ELECTRONIC SYSTEMS
December 14-16, 2020, Chennai, India
(Formerly IEEE International Symposium on Nanoelectronic and Information Systems (iNIS))
The primary objective of IEEE-iSES 2020 is to provide a platform for both hardware and software researchers to interact under one umbrella for further development of smart electronic systems. Efficient and secure data sensing, storage, and processing play pivotal roles in current information age. The state-of-the-art smart electronic systems cater to the needs of efficient sensing, storage, and computing. At the same time, efficient algorithms and software used for faster analysis and retrieval of desired information are becoming increasingly important. Big data which are large, complex data sets, are now a part of the Internet world. Storing and processing needs of the enormous amount of structured and unstructured data are getting increasingly challenging. At the same time, Internet of Things (IoT) and cyber-physical systems (CPS) have been evolving with the simultaneous development of hardware and software and span across everyday consumer electronics. The performance and efficiency of the present as well as the future generations of computing and information processing systems are largely dependent upon advances in both hardware and software.
iSES 2020 is sponsored by IEEE-CS under TCVLSI. iSES has been initiated as a sponsored meeting of the Technical Committee on VLSI, IEEE-CS (http://www.ieee-tcvlsi.org/) that endorses a league of successful meetings such as ASAP, ISVLSI, ARITH, etc., which are now presented as "Sister Conferences" in the iSES website. iSES brings together leading scientists and researchers from academia and industry.
Contributions are sought in (but are not limited to) the following areas:
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(1) Nanoelectronic VLSI and Sensor Systems (NVS)
(2) Energy-Efficient, Reliable VLSI Systems (ERS)
(3) Hardware/Software for Internet of Things (IOT) and Consumer Electronics (CE)
(4) Hardware/Software for Secure Information Processing (SIP)
(5) Hardware/Software for AI, Robotics, and Automation (AIR)
(6) Hardware/Software for Vehicular Intelligent Systems (VIS)
A detailed description of the tracks is provided on the iSES-2020 website.
iSES 2020 proceedings will be published by IEEE-CS conference publication services (CPS). Authors are invited to submit full-length (6 pages maximum), original, unpublished research papers with an abstract (200 words maximum). Papers violating length would be excluded from the review process. Previously published papers or papers currently under review for other conferences/journals should not be submitted and will not be considered for publication. Authors should submit their original work of maximum 6 pages using a double-column IEEE-CS conference format-template (CLICK HERE FOR TEMPLATE). Selected papers from iSES 2020 program will be invited for submission to a special issue of a peer-reviewed journal such as Springer Nature Computer Science based on reviewer feedback and quality of conference presentation.
Paper Submission Site: https://edas.info/index.php?c=27327
Important dates of iSES-2020 are as following:
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Submission Deadline: July 31, 2020
Acceptance Notification: September 15, 2020
Submission of Final Version: September 30, 2020
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CALL FOR SPECIAL SESSIONS: IEEE iSES 2020
6th IEEE INTERNATIONAL SYMPOSIUM ON SMART ELECTRONIC SYSTEMS
December 14-16, 2020, Chennai, India
(Formerly IEEE International Symposium on Nanoelectronic and Information Systems (iNIS))
“Selected papers from iSES 2020 program will be invited to special issues of IEEE Consumer Electronics Magazine and Springer Nature Computer Science Journal”.
iSES 2020 conference is indexed in DBLP https://dblp.org/db/conf/ises/index.
Special Sessions and Panels (SSP): iSES 2020 will consider proposals for special sessions as well as panels. Special sessions and panel proposals/papers can be submitted to the “Special Sessions and Panels” track at the online submission link. The submission deadline is the same as specified for the regular paper submissions. All accepted special session papers will be published in the conference proceedings.
Student Research Forum (SRF): iSES 2020 will host a student research forum. Authors should submit their original unpublished work of a maximum of 4 pages using the IEEE-CS double-column conference format-template. Manuscripts in PDF format with author information (optional) should be submitted to the “Student Research Forum” track at the online submission link. The submission deadline is the same as specified for the regular paper submissions. All the accepted student research symposium papers will be published in the conference proceedings.
Research Demo Session (RDS): iSES 2020 will host a research demo session. In the Research Demo Session (RDS), authors can present live demonstrations and hardware prototypes of their research papers and projects. The research demo submission can be between 1-page (extended abstract) to a maximum of 4-pages (short paper). All the accepted research demo papers will be published in the conference proceedings.
Award Information: TCVLSI sponsored student travel awards and Best Paper Awards will be awarded.
IEEE iSES 2020 is inviting proposals for special sessions.
- Special sessions typically run for 1.5-2 hours.
- Each speaker at a special session can include a paper of up to 6 pages, but minimally a 1-page extended abstract is required in the proceedings.
- All papers/extended abstracts will be reviewed before being published in the official proceedings of the conference in a separate track
- The same online submission system will be used for the review of the proposals as well as individual papers.
- Detailed submission instructions will be provided upon acceptance of the proposal.
Special Session Content:
Special sessions should address hot topics dealing with the introduction and discussion of emerging problems, or address recent technological trends in the following tracks:
- Nanoelectronic VLSI and Sensor Systems (NVS)
- Energy-Efficient, Reliable VLSI Systems (ERS)
- Hardware/Software for Internet of Things and Consumer Electronics (IoT)
- Hardware/Software for Secure Information Processing (SIP)
- Hardware/Software for AI, Robotics, and Automation (AIR)
- Hardware/Software for Vehicular Intelligent Systems (VIS)
Submission Guidelines (for a special session):
- Prepare a single PDF not exceeding three pages.
- Describe the session topic, the format, and intended audience
- Include a list of speakers with their biographical sketch and presentation titles/abstracts.
Important Dates (for a special session proposal):
- Submission Deadline: July 10, 2020
- Acceptance Notification: July 30, 2020
Submission Site: https://edas.info/index.php?c=27327
For additional information, please contact special session chairs: Srinivas Katkoori <katkoori@mail.usf.edu> and Debashis De <dr.debashis.de@gmail.com>
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ORGANIZING COMMITTEE:
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General Chairs:
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Himanshu Thapliyal, University of Kentucky, USA
V. S. Kanchana Bhaaskaran, VIT Chennai, India
Program Chair:
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Yashuhiro Takahashi, Gifu University, Japan
Program Vice Chairs:
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Tosiron Adegbija, University of Arizona, USA
Linga Cenkeramaddi, University of Agder, Norway
Publication Chairs:
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Saurabh Kotiyal, Synopsys, Inc., USA
Apeksha Bhatt, University of Kentucky, USA
Special Session Chairs:
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Tauhidur Rahman, University of Alabama, USA
Debashis De, MAKUAT, WB, India
Web Chair:
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Garima Ghai, Oriental University, India
Publicity Chairs:
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Wei Zhang, HKUST, Hong Kong
Theo Theocharides, University of Cyprus, Cyprus
Sivasubramanian A, VIT Chennai, India
Media Chair:
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Ayaskanta Swain, NIT Rourkela, India
Student Research Forum Chairs:
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Jaya Dofe, California State Univ., Fullerton, USA
Ravisankar A, VIT Chennai, India
Research Demo Session Chairs:
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- Prasanth Yanambaka, Central Michigan University, USA
Nithin Kumar Y. B., NIT Goa, India
Women in Engineering Chairs :
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Prabha Sundaravadivel, University of Texas at Tyler, USA
Peer Fathima A., VIT Chennai, India
Industry Liaison Chairs:
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Pravin Kumar Venkatesan, Velodyne LiDAR, USA
Menaka R, VIT Chennai, India
Local Arrangement Chairs:
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Sakthivel G., VIT Chennai, India
Mohamed Imran, VIT Chennai, India
Jegadeeswaran R, VIT Chennai, India
Finance Chairs:
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Sivakumar R., VIT Chennai, India
Hemanth C., VIT Chennai, India
Registration Chairs:
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Raghukiran Nadimpalli, SMBS, VIT Chennai, India
Iswarya Annapoorni, SELECT, VIT Chennai, India
Steering Committee Chair:
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Saraju P. Mohanty, Univ. of North Texas, USA
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TRACK CHAIRS:
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NVS Track Chairs:
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Rashmi Jha, University of Cincinnati, USA
Sainarayanan K S, ARM, India
Bishnu Prasad Das, IIT Roorkee, India
ERS Track Chairs:
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Amlan Ganguly, Rochester Institute of Technology, USA
Weiqiang Liu, Nanjing University of Aeronautics and Astronautics, China
IoT Track Chairs:
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Kumar Yelamarthi, Central Michigan University, USA
Varun Chandola, University at Buffalo, USA
SIP Track Chairs:
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Tauhidur Rahman, University of Alabama, USA
Shakti Sinha, Hughes Systique Corporation, India
Edmond Nurellari, University of Lincoln, UK
AIR Track Chairs:
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Hung M La , University of Nevada, USA
Ajit Jha, University of Agder, Norway
VIS Track Chairs:
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Fathi Amsaad, Eastern Michigan University, USA
Linga Reddy, University of Agder, Norway
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STEERING COMMITTEE:
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Saraju P. Mohanty, University of North Texas, USA, Chair
Dhruva Ghai, Oriental University, India, Vice-Chair
Himanshu Thapliyal, University of Kentucky, USA, Vice-Chair
Aida Todri-Sanial, CNRS-LIRMM, France
Ashok Srivastava, Louisiana State University, USA
Hai (Helen) Li, Duke University, USA
Jia Di, University of Arkansas, USA
Kamalakant Mahapatra, National Institute of Technology, Rourkela India
Srinivas Katkoori, University of South Florida, USA
Sudeep Pasricha, Colorado State University, USA
Xin Li, Duke University, USA
