One-Day Workshop on Electronic and Photonic Packaging

One-Day Workshop on Electronic and Photonic Packaging
Date: 20th July, 2019, (Saturday)
Organized by
IEEE CAS/EDS Society, Hyderabad Chapter & IEEE Photonics Society, Hyderabad Chapter
Host:'
AMS Semiconductors India Pvt Ltd, Hyderabad
Venue:
AMS Semiconductors India Pvt Ltd., 5th Floor, iLabs Tech Park,
Opp to Inorbit Mall, Hyderabad – 500 081
ABOUT THE WORKSHOP
Electronic packaging has always had its importance in the industry and has increasingly supported miniaturization. All along the growth curve of packaging technologies, the packaging module has subtlety moved a step closer to the wafer. With advances in technologies like SiP (System in Package), SoC (System on Chip), and WLP (Wafer Level Packaging) the package and wafer are no different parts of an integrated chip. Advanced packaging solutions while enabling the development of a number of complex miniaturized applications are also expected to have a number of design issues and this becomes a very important aspect of development focus.
Who Should Attend: Scientists, Engineers, Technologists, and related professionals working in Optics, Photonics, VLSI and Microelectronics are invited to attend the workshop to gain insight into technological advances in electronics and photonics packaging.
Registration: Prior registration is mandatory and admission is based on acknowledgement.
Fees: The workshop is offered at a nominal fee of 200/- for IEEE members and 300/- for non-IEEE members.
Registration Link : https://in.explara.com/e/one-day-workshop-on-electronic-and-photonic-packaging
Contacts:
Prof.P.V.Ramana Dr A G Krishna Kanth,
Vasavi College of Engineering Sr Manager, AMS Semiconductors, Hyderabad,
96666 97441 9989 644 633
pvramana@staff.vce.ac.in kk.avalur@ams.com
Workshop Agenda:
09:00 to 09.30: Registration
09.30 to 09:45: Inaugural Remarks: Mr Sai Vemuri, AMS Semiconductors
09:45 to 10:00: Address by Chief Guest, Shri BHVS Narayana Murthy, Outstanding Scientist, Director, Research Center Imarat, DRDO, Hyderabad.
10.00 to 11.00: 5G Millimetric Wave Packaging Solutions, Dr Yoon Seung Uk, Dir,JCET Group Technology Strategy, STATS CHIP PAC, SINGAPORE (over video)
11.00 to 11.30: High Tea
11.30 to 12.30: System On Chip Packaging, Mr TS Rashad , Scientist F, Research Center Imarat, DRDO, Hyderabad
12.30 to 13.15: Optical Sensors and Applications: Mr Vijay Ele, Senior Manager, AMS Semiconductors, Hyderabad.
13.15 to 14.00: Lunch and Networking:
14.00 to 15.00: LED Packaging, Mr K Vijay Kumar Gupta, CEO, Kwality Photonics Pvt Limited, Hyderabad
15.00 to 16.00: Optical Packaging Solutions and Packaging roadmap, Prof. P Venkata Ramana, Vasavi College of Engineering, Hyderabad
16.00 to16.30: IEEE Hyderabad Chapter activities and Benefits of IEEE membership
16.45 Vote of Thanks.
ABOUT IEEE PHOTONIC SOCIETY
The society is concerned with transforming the science of materials, optical phenomena and quantum electronic devices into the design, development and manufacture of photonic technologies. The Society promotes and cooperates in the educational and technical activities which contribute to the useful expansion of the field of quantum optoelectronics and applications. The Society shall aid in promoting close cooperation with other Photonic societies and councils in the form of joint publications, sponsorships of meetings and Seminars etc.
ABOUT IEEE CAS/EDS
The joint chapter of IEEE CAS/EDS society shares the common objectives of the circuits and systems (CAS) and electron devices society (EDS). The IEEE Circuits and Systems Society believes that the Grand Engineering Challenges of the 21st century can only be addressed in an interdisciplinary and cross-disciplinary manner. The Society’s unique and profound expertise in Circuits, Systems, Signals, Modelling, Analysis, and Design can have a decisive impact on important issues such as Sustainable Energy, Bio-Health, Green Information Technology, Nano-Technology, and Scalable Information Technology Systems. The EDS field-of-interest includes all electron and ion based devices, in their classical or quantum states, using environments and materials in their lowest to highest conducting phase, in simple or engineered assembly, interacting with and delivering photo-electronic, electro-magnetic, electromechanical, electro-thermal, and bio-electronic signals.
ABOUT AMS
Leading manufacturers around the globe rely on ams’ sensing know-how for advanced systems design. For ams, “Sensing is Life” and our passion is in creating the sensor solutions that make devices smarter, safer, convenient and more environment-friendly. ams’ sensor solutions are at the heart of the products and technologies that define our world today – from smartphones and mobile devices to smart homes and buildings, industrial automation, medical technology, and connected vehicles. Their products drive applications requiring small form factor, low power, highest sensitivity and multi-sensor integration. ams offers sensors (including optical sensors), interfaces and related software for consumer, communications, industrial, medical, and automotive markets.
