Cooling of Power Semiconductors

  • Subject: Cooling of Power Semiconductors
  • To:
    OUs: R70003 (Hamilton Section)
    Membership Grades: Honorary, Associate Members, Members, Senior Members, Fellows, Life Members, Life Seniors, Life Fellow, Graduate Student Members, Student Members
    Membership Status: Active
  • Reply To: "John van Loon" <john.vanloon@ieee.org>
  • Private: No

Sorry for the late notification. This is being sent out to our members so they are aware that this event is happening.

To view complete details for this event, click here to view the announcement

Cooling of Power Semiconductors


The emerging era of E-Mobility requires new approaches to maintaining thermal control in electrified vehicles. Suppliers must find innovative ways to provide solutions for the demanding requirements of battery and power electronics cooling. Fast changing system architectures and moving targets for thermal requirements, keep technology developers on their toes to develop specialized cooling products, while still achieving the stringent targets for automotive cost, quality, and robustness. This presentation focuses on Dana’s approach to providing customized power electronics cooling products, leveraging core competencies  in heat transfer modeling and design, precision stamping, and ultra clean brazing processes.

 

Date and Time

Location

  • McMaster Innovation Park
  • 175 Longwood Road S.
  • Hamilton, Ontario
  • Canada L8P 0A1
  • Building: MARC

Contact


Speakers

Meinrad Machler of Dana Canada Corp

 

Topic:

Cooling of Power Semiconductors

Nick Kalman

 

Topic:

Cooling of Power semiconductors