IEEE Electronics Packaging Society Tech Talk: Electronic Design Automation For Automotive Electronic

Dear All,

 IEEE EPS society Bangalore Chapter (formerly CPMT)  is happy to announce a technical talk on Friday, 3rd November 2017, at Golden Jubilee Hall, Department of ECE, Indian Institute of Science from 4:00 pm - 5:45 pm. You are cordially invited for the event.

 Kindly fill your details in the attached spreadsheet and mail it to suresh.v.subramanyam@intel.com  and/or  arkaprovo@simyog.com if you are planning to attend.

 The details for the event are provided below: 

 Time – 4:00 pm - 5:45 pm

 Date - 3rd November 2017, Friday

 Venue - Golden Jubilee Hall, Department of ECE, Indian Institute of Science

 4:00 - 4:15 pm - The event will commence with the felicitation of Mr. S.L.N.Murthy for his contributions to the field of Electronics Packaging.

 4:15 - 5:15 pm - 

 Technical Talk - "Electronic Design Automation For Automotive Electronics Packaging" 

 Speakers:

 Dr. Dipanjan Gope, Asst. Professor, Indian Institute of Science, and co-founder & CEO, Simyog Technology Pvt. Ltd.

 Mr. Bibhu Prasad Nayak, co-founder, Simyog Technology Pvt. Ltd.

 5:15 - 5:30 pm - Question Answer session

 5:30 - 5:45 pm - High Tea

Abstract of the talk:

 Automotive electronics is going through a period of rapid growth driven primarily by 3 different trends: (a) Safety: Advanced Driver Assistance Systems (ADAS) (b) Connectivity: Infotainment, V2X communication, autonomous driving and (c) Electrification of the powertrain: Hybrid electric vehicle, Plug-in hybrid vehicle and Battery electric vehicle. The realization of such systems lead to an integration of an ever increasing array of electric components located in close proximity to each other that interfere electromagnetically, such as power trains, wire harnesses, infotainment systems, sensors, processors, displays, etc. To that extent, the automotive represents the next generation 3D Printed Circuit Board. Mechanical and thermal design and verification tools for automotive have been available for some time – however there is a lack of electronic automotive system level design tools especially for early design stage. With the electronic bill of materials increasing rapidly to >50% of the total in an automotive product, and with the increasing investment in electric drives, an appropriate early-design tool will improve yield, reduce design cycle-time and reduce bill-of-materials incurred due to sub-optimal design.

 This seminar will discuss two key technologies in the area of Radio Frequency applications in Automotive Electronics: (a) virtual lab on a PC to test for compliance at an early design stage (b) virtual reality interface to look inside the PCB.

 Biography of the speakers:

 Dipanjan Gope, PhD, is Assistant Professor in Electrical Communication Engineering at Indian Institute of Science, Bangalore. He is also co-founder and CEO at Simyog Technology Pvt. Ltd. a spin-off from IISc focused on Design and Sign-off tools for Automotive Electronics. His research interests lie in the areas of Computational Electromagnetics, Electronic Design Automation and Radio Frequency sensing. Dr. Gope is a founding member at Nimbic (acquired by Mentor Graphics) a spin-off from University of Washington, Seattle. He received his PhD and M.S. degrees in Electrical Engineering from the University of Washington, Seattle and BTech in Electronics and Electrical Communication Engineering from the Indian Institute of Technology, Kharagpur.

 Bibhu Prasad Nayak is co-founder of SimYog Technology Pvt.Ltd. He holds the M.Tech. degree in microwave and photonics from IIT Kanpur, Kanpur,  and  currently, pursuing the Ph.D. degree at the Department of Electrical Communication Engineering, Indian Institute of Science, Bengaluru. He was with the Indian Space Research Organization, Bengaluru, from 2005 to 2007. From 2007-2017, he has been involved in electromagnetic compatibility (EMC) simulations for automotive products at Robert Bosch Engineering and Business Solutions, Bengaluru. His current research interests include 2.5-D methods, hybridization of computational techniques for system simulation, electromagnetic interference/EMC, and antenna design/analysis.

Regards,

 Suresh Subramanyam, Chapter Chair ( suresh.v.subramanyam@intel.com)

 Arkaprovo Das, Chapter Secretary ( arkaprovo@simyog.com)

 

 On behalf of the committee members of IEEE EPS Bangalore Chapter

 

Tech Talk Detail Sheet