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Semiconductors and AI: Architecting the Future
Artificial intelligence is no longer just a software story. Behind every large language model and every AI-powered breakthrough lies a physical substrate — and the race to build it is reshaping the semiconductor industry at its core. This panel brings together voices from the lab and the industry floor to examine the challenge at the heart of the AI era. How has explosive AI demand rewritten what chips need to do — and what it takes to make them? What separates an AI accelerator from everything that came before it? And what does it mean for manufacturing, supply chains, and global competition when demand outpaces the industry's ability to keep up?
From thin film deposition and nanofabrication to fab operations, equipment markets, and national semiconductor strategy, our panelists bring rare depth to questions that will define the next decade of technology. This is not a conversation about chips in the abstract — it is a conversation about the physical foundations of the AI future, and the very real challenges of building them at scale.
Date and Time
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Location
- This event has virtual attendance info. Please visit the event page to attend virtually.
Hosts
- Richmond Section Affinity Group, YP
- Central Tennessee Section Affinity Group,YP
- Alabama Section Affinity Group, YP
- Orlando Section Affinity Group,YP
- Huntsville Section Affinity Group, YP
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Registration
- Starts 14 April 2026 12:00 AM EDT
- Ends 30 April 2026 06:00 PM EDT
- No Admission Charge
Speakers
Robert Quinn
Semiconductor Manufacturing and AI
Agenda
- Technical presentation by Robert Quinn
- Panel discussion
- Audience Q&A