Re: Recent advances in printable materials and thin film electronic devices and circuits

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Recent advances in printable materials and thin film electronic devices and circuits

Printed and flexible electronics enable interesting novel applications in the fields of sensors [1], bioelectronics [2], and security applications [3], to name but a few. Most of them gain their functionality from a layered structure composed of different materials that interact with each other. For semiconducting layers, organic and inorganic materials can be used; in this regard, the respective functional materials need to be formulated into inks that are then printed on various substrates. The structuring process of printing is a complex process in which many chemical and physical process parameters need to be controlled at the same time, such as drop volume, the waveform of the electrical signal controlling droplet formation, or the drying time. Also, the surface of the substrate plays a decisive role in printing accuracy and layer morphology. After printing, post-treatments are often necessary to obtain the desired features, since the properties of bulk materials often differ from printed nanoparticulate or precursor-derived layers.

This presentation starts by introducing various semiconducting inks based on either nanoparticle or precursor solutions and discusses thin film properties, microstructure, and finally the step-by-step device fabrication processes. Various printing techniques such as (super)-inkjet, laser printing and microplotting will be shown. These printed materials display advantages such as high carrier mobilities, transparency, stability in air, and non-toxicity, and can be prepared mostly by using water or alcohol-based solvents. Finally, examples of hybrid sensor systems comprising printed and standard CMOS components will be elaborated on.

 

[1] Cadilha Marques, Gabriel, Dennis Weller, Ahmet Turan Erozan, Xiaowei Feng, Mehdi Tahoori, und Jasmin Aghassi‐Hagmann. „Progress Report on “From Printed Electrolyte‐Gated Metal‐Oxide Devices to Circuits”. Advanced Materials 31, Nr. 26 (Juni 2019): 1806483. https://doi.org/10.1002/adma.201806483.

[2] Mahsa K. Saghafi, Srivatsan K. Vasantham, Navid Hussain, George Mathew, Federico Colombo, Barbara Schamberger, Eric Pohl, Gabriel Cadilha Marques, Ben Breitung, Motomu Tanaka, Martin Bastmeyer, Christine Selhuber-Unkel, Ute Schepers, Michael Hirtz, Jasmin Aghassi-Hagmann, “Printed Electronic Devices and Systems for Interfacing with Single Cells up to Organoids”, Adv. Funct. Mat., Early View, 2023, https://doi.org/10.1002/adfm.202308613

[3] Zimmermann, Lukas, Alexander Scholz, Mehdi B. Tahoori, Jasmin Aghassi-Hagmann, und Axel Sikora. „Design and Evaluation of a Printed Analog-Based Differential Physical Unclonable Function“. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 27, Nr. 11 (November 2019): 2498–2510. https://doi.org/10.1109/TVLSI.2019.2924081.

 

Date and Time

  • Date: 15 Nov 2024
  • Time: 06:00 PM to 07:30 PM
  • All times are (UTC+01:00) Berlin
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Location

This event has virtual attendance info. Please visit the event page to attend virtually.

Hosts

Registration

  • Starts 20 October 2024 04:20 PM
  • Ends 15 November 2024 06:00 PM
  • All times are (UTC+01:00) Berlin
  • No Admission Charge

Speakers

Jasmin Aghassi-Hagmann of Karlsruhe Institute of Technology (KIT)

J. Aghassi-Hagmann is a full professor at the Institute of Nanotechnology (INT) of the Karlsruhe Institute of Technology (KIT) in the Department of Electrical Engineering and Information Technology. She received her diploma in physics from RWTH Aachen and PhD from KIT, Karlsruhe. She has spent several years in R&D in the semiconductor industry (Infineon Technologies, IBM Semiconductor Alliance East Fishkill, Intel) developing advanced CMOS nodes. Her research interests are solution processible materials, 2D and 3D functional printing as well as thin film electronic devices and circuits. She serves in various national and international committees such as topic speaker in the Helmholtz Society Research Program Materials System Engineering, and is a member of the executive editorial boards of J-FPE and IEEE J-FLEX and others. 


Agenda

 

  1. Introduction and greetings - 5 minutes
  2. Main talk - 55 to 60 minutes
  3. Q&A - 25 to 30 minutes

 


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