Dear Colleagues,

It is our great pleasure to invite you to submit an abstract to the IEEE 30th International Symposium for Design and Technology in Electronics Packaging  (SIITME, web: CfP SIITME 2024) organized in Sibiu, Romania from Wednesday, 16 October to Saturday, 19 October 2024.

We hope you will find this conference and exhibition with the participation of regional companies active in the field of Automotive Electronics and Systems, Power Electronics, Electronics Packaging and Telecommunication attractive to present your most recent research results and we encourage you to submit an abstract.

For abstract template and some further information about the conference submission platform please refer to our homepage  siitme.ro

Deadline for abstract submission is: 30th June 2024.
Notification of acceptance: 19th July 2024
Early bird registration:  1st September 2024
Full Paper Submission: 22nd September 2024

Conference Topics

A. Emerging Topics in Advanced Packaging;
B. New Components and Manufacturing Technologies;
C. Printed Electronics, Smart Textiles and Healthcare;
D. Sensors, Actuators and Microsystems;
E. Nanomaterials, Nanoelectronics and Nanotechnology;
F. Embedded Systems, Robotics and Artificial Intelligence;
G. Power Electronics and Thermal Management;
H. Smart Grid and Renewable Energy;
I. Virtual Prototyping and System Validation;
J. Quality Management, Applied Reliability, Characterization and Testing Failure Diagnosis;
K. Corrosion in Electronics;
L. Challenges in Digitalisation and Global Education for Electronics.

Please feel free to forward the enclosed call to your colleagues and co-workers who might be interested to attend at this event as well.

The conference is intended to be a traditional, in person event, which will give us the possibility for greater interaction and socialization.

The official conference language is English.

We are looking forward to your contribution to SIITME2024.

Kind regards from Sibiu,

Local Conference Organizing Committee