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Advanced Packaging for Artificial Intelligence Applications: Technical Challenges
Mudasir Ahmad (IEEE-EPS Distinguished Lecturer)
The Global Artificial Intelligence (AI) market was valued at USD 150 billion in 2023 and is projected to grow at a CAGR of 36.8% to reach USD 1,345 billion by 2030 [1]. From computer vision to natural language processing to co-pilots, AI applications are rapidly expanding and are permeating virtually every aspect of business and personal life. Key to the growth of AI are the plethora of software and hardware that process large amounts of data for rapid training and inference.
A foundational technology to enable the rapid growth and deployment of AI is Advanced Packaging. Advanced Packaging has already been enabling other applications like High Performance Computing, General Computing, Networking, IoT etc., which in turn are driving AI growth. In addition, AI applications such as AI Accelerators require specialized focus to enable the speed, cost, scaling, reliability needed for deploying AI on the scale and complexity expected in the next decade.
In this talk, an overview of the different AI applications will be presented along with some AI Algorithms, Applications and Hardware Enablers. Some of the commonly used Advanced Packaging solutions will be discussed, and the corresponding challenges/trade offs will be presented, spanning Power, Thermal, Manufacturing, Test, Reliability, Supply Chain and Cost. Specifically, some of the key advanced packaging challenges for system level hardware solutions for AI will be outlined.
By the end of this talk, the attendee will be able to make the connections between the high level needs posed by AI applications and the sort of technical challenges that Advanced Packaging needs to address, to enable those AI applications. The attendee will be able to identify some of the tradeoffs that need to be made, to enable optimal hardware solutions to deliver AI at the scale, volume and complexity needed currently and over the next several years. Finally, the attendee will be able to outline some of the key technical challenges that need to be addressed in Advanced Packaging for AI applications.
Date and Time
- Date: 18 Jun 2024
- Time: 03:00 PM to 04:30 PM
- All times are (UTC+02:00) Paris
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Location
- World Trade Center – 5-7, Place Robert Schuman
- Grenoble, Rhooe-Alpes
- France 38000
Hosts
Registration
- Starts 24 April 2024 12:00 AM
- Ends 18 June 2024 12:00 AM
- All times are (UTC+02:00) Paris
- No Admission Charge
Inscription (gratuite) par email à jean-charles.souriau@cea.fr
