Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC
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Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC
Silicon photonics are the semiconductor integration of EIC and PIC on a silicon substrate (wafer) with complementary metal-oxide semiconductor (CMOS) technology. On the other hand, co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) and the electrical engine (EE) which consists of the electronic ICs (EIC) as well as the switch ASIC (application specific IC). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of a higher level of heterogeneous integration of PIC and EIC, whether it is for performance, form factor, power consumption or cost. The content of this lecture is shown below.
Date and Time
- Date: 05 Mar 2024
- Time: 12:00 PM to 01:00 PM
- All times are (UTC-05:00) Indiana (East)
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Virtual Link and In-person Location
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Reminder of today's lecture "Co-packaged optics - Heterogenous integration of photonic IC and electronic IC." by Dr. John Lau
- Time: Tuesday, March 5th, 2024, 12:00 PM – 1:00 PM (EST) (The food will be served 15 mins prior to noon)
- Location: BRK 1001 (Birck Nanotechnology Center)
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https://purdue-edu.zoom.us/j/92033532008?pwd=TDY3QWlTc0NBMWZWMjB4ZGszWTlWUT09
Meeting ID: 920 3353 2008
Passcode: 225904
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- BRK 1001
- 1205 W State St
- West Lafayette, Indiana
- United States 47907
- Building: Birck Nano Technology Center
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Registration
- Starts 19 February 2024 11:31 AM
- Ends 05 March 2024 11:31 AM
- All times are (UTC-05:00) Indiana (East)
- No Admission Charge
Speakers
Dr. John H. Lau of Unimicron Technology Corporation
Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC
