Dear Microelectronics and Reliability Professional,

I would like to bring to your attention the Call for Abstracts for ESTC-2024, the premier international event in the field of electronics packaging and system integration.

IEEE Electronics System-Integration Technology Conference

September 11-13, 2024 - Berlin, Germany

Join us in Berlin from September 11-13, 2024, to present your work to the international audience. If you are interested in presenting a paper or a poster at IEEE ESTC, please submit your abstract with a maximum of 500 words by March 1st, 2024!

Information on the call for papers and the abstract submission process can be found in the attached leaflet and on the conference website at

https://www.estc-conference.net/

We rely on your participation for this event.

With best regards

Dr Stoyan Stoyanov
Chapter Chair, IEEE UK and Ireland Electronics Packaging and Reliability Joint Chapter