[INTERCON 2023] Call for Papers - Extended Deadline to August 15th
[INTERCON 2023] Call for Papers - Extended Deadline to August 15th
Dear all,
we hope this message finds you well. We are excited to announce the IEEE INTERCON 2023, which will be held from 02 to 04 November in Universidad Peruana de Ciencias Aplicadas (UPC), Lima - Peru.
IMPORTANT DATES:
- Paper submission deadline (Extended): August 15th, 2023
- Notification: September 15, 2023
- Camera-ready: October 05, 2023
- Author registration deadline: October 12, 2023
SUBMISSION GUIDELINES
The conference invites research papers of varying length from 6 to 8 pages (including abstract and references) and written in English. For all accepted papers, the authors will be asked to sign a copyright transfer on the contents of their paper(s). The accepted papers will be indexed and published on the IEEE Xplore Digital Library. All papers, only in PDF file, must be submitted electronically through the EasyChair:
https://easychair.org/conferences/?conf=2023ieeeintercon
The format of the papers is based on IEEE conference template, which can be downloaded from:
https://www.ieee.org/conferences/publishing/templates.html
TOPICS OF INTEREST
Papers presenting original and innovation work in, but not limited to, the following tracks are invited for submission:
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T1. Artificial Intelligence and Machine learning
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T2. Communications and Networking
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T3. Power, Energy, and Power Electronics
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T4. Biomedical Engineering and Healthcare Technologies
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T5. Robotics, Control, Instrumentation, and Automation
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T6. Multimedia Signal Processing and Analytics
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T7. Devices, Circuits, and Materials
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T8. RF Circuits, Systems, and Antennas
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T9. Data Science and Computing Technologies
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T10. Education in Engineering and Technology
CONFIRMED KEYNOTE SPEAKERS:
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Omer T. Inan, Georgia Tech University (USA)
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Jyotika Athavale, RAS Architect at Synopsys (USA)
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Suyeon Kim, PUCP (Peru)
ORGANIZING COMMITTEE
General Chair:
César A. Beltrán Castañón, IEEE Peru Section Chair
General Co-Chair:
Yván Tupac Valdivia, Universidad Católica San Pablo, Peru
Finance Chair:
Jimmy Túllume Salazar, IEEE Peru Section Chair
Publication Chair:
Pedro Shiguihara Juárez, Universidad San Ignacio de Loyola, Peru
Local Organizers:
Yohanna Villanueva, Universidad Peruana de Ciencias Aplicadas, Peru
Carlos Valdez, Universidad Peruana de Ciencias Aplicadas, Peru
Nikolai Vinces, Universidad Peruana de Ciencias Aplicadas, Peru
Publicity Co-Chairs:
José Durán Talledo, IEEE Peru Section Chair
Conference Contact:
informes@ieee.org.pe
Advisory Committee:
Carlos Silva Cárdenas
Ernesto Cuadros Vargas
William Ipanaqué Alama
