Mile High Spark Mar/Apr 2022

 

 

March/April 2022 Volume 13 Issue 2

Section Officers:
ChairJames Sipes
Vice-Chair: Jeff Hardy
Treasurer: Avijit Saha
SecretarySantosh Veda

Local Events     News     Interesting Links

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Whether you are active in IEEE ExCom, are a chair of a technical society, or just a paying member, we thank you for being a part of something that we think is pretty great. If you want to get more involved, you know where to find us! And if you just want to enjoy the hard (and not-so-hard) work of our volunteers by attending our events we would love that even more! Take advantage of the monthly volunteering efforts we have put together for you. Try something new, meet some new people, and learn something new by listening to a distinguished lecturer. Oh, and thank you for being a reader of our newsletter!

ExCom Meetings

We are going back to in-person meetings. We will continue to offer virtual for those unable or uncomfortable with being there.

Notices will be sent when they will be held.  We will advise everyone when they are back in person.

Recent ExCom Actions

  •  2021 Budget
  • 2021 Rebate Policy

New! - eBooks

Computer and Information Security Handbook

A Security Strategy for Avionics Systems

Monitoring 101: 
A primer to the philosophy, theory, and fundamental concepts involved in systems monitoring

Improving RF GaN Success

Essentials of Edge Computing

Mastering Millimeter-Wave Communications Circuit Design

In This Issue

Message From the Chair

Editor's Column

 Conferences/Summits/Call for Papers/Workshops/Tutorials

Upcoming Events


 NEW!! IEEE Conferences

The following like takes you to the full listing of IEEE USA 2022 conferences https://ieeeusa.org/calendar/conferences/

New! - eBooks

First Annual Spring Social

Enjoy an evening of food and conversation with other engineers, family and friends.  Grilled hamburgers and hotdogs will be provided with some side dishes.  Bring an attitude of fun, side dish and/or non-alchoholic beverage to share.  Games and use of the pool and hot tub are available.  

Location: Clovis Point Apartment Club House, 1855 Lefthand Creek Lane, Longmont, CO 80501 (Location rules and guidelines must be adhered to while on site.)

Date: Thursday, May 5, 2022 at 6:00 to 8 PM

Who: Registered IEEE members, family and friends. Registration is limited based on location capacity.

Founding sponsor is the joint chapter of the AESS-SPS of Denver and the High Plains

  • Add Event to Calendar

iCal
Google Calendar

This is an in person event. 

Though this is an in person event, please note that COVID spikes have happened accross the nation and meeting in person is at your own risk.  

Hosts

Registration

  • Starts 27 April 2022 08:00 PM
  • Ends 04 May 2022 11:55 PM
  • All times are America/Denver
  • No Admission Charge

Message from Jim Sipes, Chair, IEEE Denver Section, Jim Sipes - jsipes@ieee.org 

Some bits and bytes of good news…

As I expected but couldn’t confirm last time, we had nine Senior Member upgrades approved in the Denver Section as of the February meeting of the review committee. The new Senior Members are Lin Cheng, David Ganger, Anderson Hoke, Hassaan Idrees, Nereus Lobo, Jouni Peppanen, Thomas Tessier, Vasudeva Venkatachala Rao, and Bin Wang. Congratulations to all!

The upgrade review committee met again on April 23, but it does not appear that there were any Denver Section members up for review this time. The committee will meet again on June 25, and we currently have three members in the pipeline for that meeting. There is still plenty of time to get your application submitted, so if you are interested and feel you are eligible for the upgrade, the requirements are set out on the IEEE website at https://www.ieee.org/membership/senior/senior-requirements.html, and we have a list of existing Senior Members who have volunteered to serve as references for those seeking the upgrade. If you want to proceed, please contact me at chair@ieee-denver.org or Jeff Hardy at vice-chair@ieee-denver.org.

Speaking of upgrades, we currently have a number of associate members in the section. Elevation from associate to full member provides the full benefits of IEEE membership, including eligibility to hold volunteer officer positions. It is a very simple process, requiring only the updating of one’s membership profile to demonstrate regular employment in IEEE-designated fields with a combination of education and work experience of at least six years.

The IEEE Congressional Visit Day was held virtually again this year, with four of our members taking part in conversations with Congressional staffers from the offices of Senators Bennet and Hickenlooper, and Representatives Crowe, Perlmutter, and Neguse. Feedback from our section participants was uniformly positive.

The Colorado Science and Engineering Fair (CSEF) was held on the Colorado State University campus with in-person judging on April 7. Two hundred fifteen of the top projects from the thirteen regional fairs were on display from students across Colorado in grades 6–12. We selected five of the projects to advance to the Regeneron International Science and Engineering Fair to be held in Atlanta in May. The Denver Section has been a Silver Sponsor of CSEF for several years and holds two positions on the CSEF Board of Directors; the fair is always looking for judges and volunteers, so if you have any interest in participating, please drop me a line.

As noted elsewhere in this issue, the Power and Energy Society will hold its General Meeting at the downtown Sheraton in Denver on July 17-21. Volunteers are needed, with meals and complementary attendance in exchange for shifts worked. Plus a free conference volunteer T-shirt! More information is available at https://pes-gm.org/call-for-local-denver-pes-volunteers/.

And one bit of not-so-good news… You may have heard of the planning for this year’s Build Something Cool event that was to be held on April 9 on the Metro State University Auraria campus. Unfortunately, the event had to be canceled this year. Likely because of Covid concerns, we did not have enough students sign up this year to make the event viable. We’re still working with our Metro State partners to find other ways to deliver the same experience to the students or to reschedule the event for later in the year. Stay tuned for more information.

As always, we continue to have many opportunities to contribute as a volunteer to the Section or to your Chapter/Group of choice, and all are welcome at the monthly ExCom meetings on the third Tuesday of the month (except December and July). For our April meeting we were able to go face-to-face with online WebEx attendance as well, and my hope is that we will be able to continue with that format. There is a listing of the current chapters and groups supported by the Denver Section on the Section’s website, https://ieee-denver.org, under the menu heading Denver Groups. Contacts for each of the chapters/groups are available on the individual chapter/group websites.

Until next time, stay safe.

Jim

chair@ieee-denver.org


From the Editor's Desk, Ernest Worthman - ernest_worthman@ieee.org

Corporate Greed

In recent weeks I have seen and heard some interesting news about the profits of the oil companies and semiconductor manufacturers. And I am not happy about it.

Apparently, both the oil and semiconductor segments have been reaping obscene profits at the expense of the consumer, capitalizing on the current state of the global geopolitical environment.

This has not gone unnoticed. In fact, recently our president actually made a public statement to that effect about how the oil and gas industry is being extremely “opportunistic” with their pricing, leading to what some have called, gouging the consumer.

I expect this from the fossil fuel industry. I have been around long enough to have seen this in the past, more than once.

What I did not expect was the semiconductor industry to act like the extremely greedy and unsocially conscious fossil fuel industry

Sure, there are boom and bust cycles. But the truth be told, the semiconductor industry brought on these cycle themselves. They have never been particularly good at forward-looking to make their supply chain follow trends. It is somewhat antiquated, with respect to how it has, and still does, function. By that I mean it just pumps out silicon with little awareness of its markets, so it goes through the boom-and-bust cycles regularly (although they are finally starting to rework their models).

In normal times, since we are a capitalistic society, taking advantage of market conditions is generally OK, as long as the advantage-takers are not doing anything illegal or overly unconscionable (believe it or not, I am an honest capitalist). In the past, such periods have, generally, been self-regulating and short-lived until the supply problem and competition level the playing field.

However, at this time, given the global economic and political conditions one would think they might have just a twinge of consciousness. Gouge us a little but exercise some restraint. But apparently, there is absolutely no social consciousness with them right now.

Another interesting development, although a bit tangential but certainly related is that CEO pay has risen ridiculously during the pandemic. Perhaps they are being rewarded for how much they can capitalize on the consumer’s malaise. The chart below shows that 2020 saw the biggest jump in CEO Pay since 2000, which was also a recessionary period. I am not going to dwell on this or push an agenda, it is just an interesting, related fact.

But on the chip side, one has to wonder how the chip industry managed to record profits amid widespread shortages. 2021 was a record year for the global chip industry as revenues exceeded half a trillion dollars, $100 billion above the next highest year on record in 2018.

This has to affect 5G, as well as high tech in general. 5G has been emptying the coffers of the wireless players for a year or two now. Most of them have just relegated themselves to eating the costs involved in 5G, betting on the come that it will start to pay off in the next few years. Now, with the inflationary and other hits on their hardware, which seems like a bitter pill to swallow (although for the longest time the carriers were gouging, as well).

This is simply a case of greed. The demand for chips soared. One factor was the work-from-home as added pressure on hardware as a result of the pandemic. The chip makers wasted no time in capitalizing on this double whammy (of course, had the last administration not vilified China, we would have been in a much better position all along). 2021 revenue of $586.8 billion for all chipmakers was 24 percent above 2020 (while the inflationary number at the consumer level is in the double digits).

Analysts used all kinds of verbiage to describe what I will, for this sentence, politically correctly call the anomaly. For example, Omdia, one of the many analysis organizations that calls itself a global research leader, pegged 2021 as a “remarkable year for the industry” because revenues reached a record $586.8 billion, and nearly 60 percent of companies in the sector grew revenues by more than 20 percent (just in – Samsung came in at a whopping 50 percent estimated increase in profit for the first quarter of 2022). Wow! That is quite a way to sugarcoat greed. But then, companies like Omdia do not benefit from biting the hand that feeds them.

Under different circumstances, these profits would be hailed as exemplary. But in this case, it is embarrassing. The almighty dollar overarches everything.

This is the time for industries such as oil, semiconductors, agribusiness, utilities and so many more to step up to the plate. Take one for the team so that the poor consumer, who always ends up footing the bill, anyway, for once, can get a bit of consideration.


 


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AGL eDigest NewsletterCurrent Happenings in the Wireless Space 6G world - A Look Into the Next Generation of Wireless

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On the EdgeWireless Power is Changing the World  Insight – How 5G Will Influence Autonomous Driving Systems
Guest Column – How to Reduce Power Consumption in EV HMIs  Tech Talk – Low-Dropout Regulators Explained

Technical Articles, Reports, App Notes, and While Papers

NVMe Unlocks Data Access and Analysis at the Source. By Premio
Threats and Countermeasures of Cyber Security in Direct and Remote Vehicle Communication Systems. By Subrato Bharati, Prajoy Podder, M. Rubaiyat Hossain Mondal, and Md. Robiul Alam Robel 
Addressing Design Challenges for EV Charging Systems. By Mark Swinburn 
Switcher ICs in Power Design for Smart Home and Appliances. By Power Integrations
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A Primer to the Philosophy, Theory, and Fundamental Concepts Involved in Systems Monitoring. By Solarwinds
A Compendium of Op Amp Design Topics. By Bruce Trump, Texas Instruments
A Journey Towards Next Generation Wireless - 6G. By Saifullah, Umar Ajaib Khan, Zhi Ren, A.Azeem, RiazWaqar 
Innovative Designs for Optimizing 112g+ BGA Fan-Out and Connector Footprint Crosstalk. By TE Connectivity
RF/Microwave Equalizers: An Essential Ingredient for the Modern System Designer. By MiniCircuits

 

 

 


 GEEK GIRLS 
Inequality and Opportunity in Silicon Valley
by France Winddance Twine 

NYU Press | Hardcover | 9781479803828 | 296 pp. | 8 B&W illus. | Social Science | May 10th, 2022

Why is being a computer “geek” still perceived to be a masculine occupation? Why do men continue to greatly outnumber women in the high-technology industry? Since 2014, a growing number of employment discrimination lawsuits has called attention to a persistent pattern of gender discrimination in the tech world. Much has been written about the industry’s failure to adequately address gender and racial inequalities, yet rarely have we gotten an intimate look inside these companies. In Geek Girls, France Winddance Twine provides the first book by a sociologist that “lifts the Silicon veil” to provide firsthand accounts of inequality and opportunity in the tech ecosystem. This work draws on close to a hundred interviews with male and female technology workers of diverse racial, ethnic, and educational backgrounds who are currently employed at tech firms such as Apple, Facebook, Google, and Twitter, and at various start-ups in the San Francisco Bay area. Geek Girls captures what it is like to work as a technically skilled woman in Silicon Valley.

With a sharp eye for detail and compelling testimonials from industry insiders, Twine shows how the technology industry remains rigged against women, especially Black, Latinx, and Native American women from working-class backgrounds. From recruitment and hiring practices that give priority to those with family, friends, and classmates employed in the industry, to social and educational segregation, to academic prestige hierarchies, Twine reveals how women are blocked from entering this industry. Women who do not belong to the dominant ethnic groups in the industry are denied employment opportunities, and even actively pushed out, despite their technical skills and qualifications.

While the technology firms strongly embrace the rhetoric of diversity and oppose discrimination in the workplace, Twine argues that closed social networks and routine hiring practices described by employees reinforce the status quo and reproduce inequality. The myth of meritocracy and gender stereotypes operate in tandem to produce a culture where the use of race-, color-, and power-evasive language makes it difficult for individuals to name the micro-aggressions and forms of discrimination that they experience.

Twine offers concrete insights into how the technology industry can address ongoing racial and gender disparities, create more transparency and empower women from underrepresented groups, who continued to be denied opportunities.

About the Author: France Winddance Twine is a Professor of Sociology at the University of California, Santa Barbara. She is the author and a co-editor of ten books, including Outsourcing the Womb: Race, Class and Gestational Surrogacy in a Global Market and A White Side of Black Britain: Interracial Intimacy and Racial Literacy. (Pronouns: she/her/hers)


 

IEEE Women in Engineering International Leadership Conference 2022 - June 6-7 | San Diego, CA, USA | Hybrid

IEEE WIE ILC attendees are mid-to senior level professional women in technology seeking to advance their leadership skills and network with other professionals. We want the talks to reflect information or skills that our attendees need to improve their lives, whether that improvement is a new technical, management, or organizational skill. We also want our speakers to be as diverse and inclusive as our audience, so that our attendees can see themselves in the program and can see themselves as future WIE ILC speakers. For more information, click on the title link.


Volunteer Wanted - A Unique  Opportunity for IEEE Denver Section Members

Members of the Denver section have a unique opportunity to participate in the 2022 IEEE Power & Energy Society General Meeting. The conference is coming to Denver on 17-21 July 2022 and we are looking for local volunteers to assist with the event. 

Volunteers will come together with Power & Energy peers to perform a wide variety of roles including welcoming, directing people, assisting with sessions, and coordinating. Volunteers will receive a free hour of meeting attendance, excluding paid events, for every hour of volunteer time. Lunch or dinner will be provided for volunteers taking two shifts back-to-back. Official Volunteer T-shirts and identification will also be provided.

Is it possible to share this opportunity with your section members and help promote it through your social media, event calendar, or Mile High Spark Newsletter? 

Please don’t hesitate to reach out with any questions. More information regarding volunteer roles, requirements, and incentives is available here: https://pes-gm.org/call-for-local-denver-pes-volunteers/

Thank you,

Erica DeProspo

Audience Development Associate 

IEEE Meetings, Conferences & Events (MCE) | 445 Hoes Lane, Piscataway, NJ 08854 USA t: +1 732 562 2645 | e.deprospo@ieee.org | www.ieeemce.org


Congressional Visits Day - Pictures and Notes

(Click on the above to open the PDF)


Conferences/Summits/Call for Papers/Workshops/Tutorials

2022 IEEE World AI IoT Congress (AIIoT)

Virtual conference; 6 - 9 June 2022, Seattle, WA USA

We are pleased to announce the 2022 IEEE 12th World AI IoT Congress (IEEE AIIoT 2022), will be held during 6-9 June 2022. Unlike the previous years, this year due to the COVID-19 pandemic we will be hosting the conference virtually to maintain continuity.

The conference aims to bring together scholars from different backgrounds to emphasize dissemination of ongoing research in the fields of Computing, Electronics and Mobile Communication. Research papers are invited describing original work in above mentioned fields and related technologies. The conference will include a peer-reviewed program of technical sessions.

All accepted papers will be presented virtually during the parallel sessions of the conference and the accepted, presented papers will be submitted for publication at IEEE Xplore® digital library (Scopus, Web of Science, and Google Scholar). The full list of indexing and discovery services can be found at:
https://www.ieee.org/content/dam/ieee-org/ieee/web/org/pubs/ieee_indexing_agreements.pdf

CONFERENCE URL: https://worldaiiotcongress.org/

REGISTRATION: https://worldaiiotcongress.org/registration/


IEEE ComSoc International Communications Quality and Reliability Workshop (CQR 2022)

The CQR 2022 will be held 13–15 September 2022 in  Georgetown, Washington D.C. physically and also virtually. CQR 2022 will bring together industry and academic experts to present and discuss communications quality, reliability and security issues as they relate to real world issues.

You are invited to submit a paper or poster describing innovative research results, problem solutions, experiences, and new challenges related to various aspects of QoS and Reliability.

Paper Submission Deadline: 3 June 2022     


IEEE International Symposium on Local and Metropolitan Area Networks

IEEE LANMAN 2022, a forum for presenting and discussing the latest technical advances in local and metropolitan area networking, will be held from July 11 to 12, 2022.

Speculative and potentially transformative ideas are particularly encouraged, as are studies reporting measurements from real-life networks and testbeds. Papers are solicited on any topic in networking. See the above links for more information.

Submissions are due March 31, 2022.


EMC+SIPI Call for Submissions for the 2022 IEEE International Symposium on Electromagnetic Compatibility,

Learn More

The 2022 IEEE International Symposium on Electromagnetic Compatibility, Signal & Integrity (EMC+SIPI) is seeking submissions! 

The 2022 symposium will be held 1-5 August 2022 in Spokane, Washington. In addition to the many technologies this conference covers that may be of interest to you, you are also eligible to receive the discounted IEEE Electromagnetic Compatibility Society (EMC) Member rate to attend since you are a member of an EMC Sister Society.

Please see the above links for symposium topics and other pertinent information and registration.

If you have expertise in these areas, please contribute to the technical program! Learn more about all possible topics of interest and technical areas here.

Papers, proposals for special sessions, workshops, tutorials, experiments and demonstrations can be submitted using our portal: www.emc-sipi2022.abstractcentral.com  

Signal & Integrity is Now Open! Receive a discounted rate to attend as an EMC Sister Society member.


 


The Global Symposium on Millimeter-Waves & Terahertz (GSMM) will be held on 18 - 20 May, 2022 in Seoul, Korea.

GSMM is an annual forum for researchers, engineers and practitioners to present and discuss recent breakthroughs, innovations and emerging techniques in the fields of millimeter-wave and terahertz sensing and communications. This waveband is very important in various applications to improve industry and the advancement of the human life. Millimeter-waves & terahertz technologies are applied widespread to 5G networks, communications, measurements, medical care, biochemistry, and other fields. Under the symposium theme, New Wave Technology for New Normal Life, it will cover millimeter-wave and THz electronics, antennas, circuits, devices, systems and applications.

*Contact us* Email: info@gsmm2022.org; Website: www.GSMM2022.org


IEEE International Conference on High Performance Switching and Routing (HPSR)

The IEEE International Conference on High Performance Switching and Routing (HPSR 2022) will be held virtually and in person 6–8 June 2022 in Taicang, Jiangsu, China.

The main focus of HPSR 2022 – the 23nd edition of HPSR conference – will be to assess how breakthrough changes occurring to networks and telecom are affecting areas related to switching, routing, computing and communication networks in general.

We are soliciting original and thought-provoking works on big data, data analytics, cloud/edge services, and machine-learning techniques applied to networking, computing, switching and routing. Works on autonomous networks, 5G and beyond, IoT, Industry 4.0, social networks, satellite and space networks, cybersecurity, virtualization, and other advanced topics are also welcome.


IEEE International Conference on Communications, Control, and Computing Technologies for Smart Grids 2022 (SmartGridComm) 25–28 October 2022 // Singapore // Virtual

The 2022 IEEE International Conference on Communications, Control, and Computing Technologies for Smart Grids (SmartGridComm 2022) will be held 25–28 October in Singapore and online.

Prospective authors are invited to submit original papers using EDAS (under the track “SmartGridComm 2022”) on all aspects of communications, control and computing technologies for smart grids covered by the four technical symposia.

Paper Submission Deadline: 10 June 2022 


IEEE Global Communications Conference

IEEE Global Communications Conference (GLOBECOM) will be held in Rio de Janeiro, Brazil, from 4-8 December. Themed “Accelerating the Digital Transformation through Smart Communications,” this flagship conference of the IEEE Communications Society will feature a comprehensive high-quality technical program including 13 symposia and a variety of tutorials and workshops.

GLOBECOM 2022 will also include an attractive Industry program, with keynotes and panels from prominent research, industry and government leaders, business and industry panels, and vendor exhibits.

Important Deadlines Symposium Paper Submissions: 15 April 2022 (23:59 EST) (FIRM) Workshop Paper Submissions: 15 July 2022

In addition to symposium papers, we are currently accepting submissions for workshop papers. GLOBECOM 2022 will feature a series of half and full-day workshops. The aim of the conference workshops is to emphasize emerging topics that are not specifically covered in the main symposia. Each workshop may include a mix of regular papers, invited presentations, keynotes and panels that encourage the participation of attendees in active discussion.


IEEE International Symposium on Personal, Indoor & Mobile Radio Communications; 12–15 September 2022 // Virtual

The 2022 Annual IEEE PIMRC will be held virtually 12-15 September 2022. IEEE PIMRC 2022 welcomes contributions reporting original research results in all areas of wireless technology as well as in applications, services, and business. Prospective authors are invited to submit technical papers of their previously unpublished work. All accepted and presented papers will be submitted to IEEE Xplore. Topics of interest should be included within the following Tracks: Track 1: PHY and Fundamentals Track 2: Networking and MAC Track 3: Practical and Experimental Systems Track 4: Applications, Platforms, and Business.


 The 8th IEEE World Forum on the Internet of Things (WFIoT2022)

WFIoT2022 seeks submissions and proposals for original technical papers and presentations that address the Internet of Things (IoT), its theoretical and technological building blocks, the applications that drive the growth and evolution of IoT, operational considerations, experimentation, experiences from deployments, and the impacts of IoT on consumers, the research community, the public sector, and commercial verticals.

The theme for WFIoT2022 is “Sustainability and the Internet of Things”, encouraging the submissions of content aimed at growth of IoT across the world and the reduction of harmful and environmental impacts. The World Forum will be held as a hybrid event, accepting in person and virtual presentations, and will be conducted 26 October-11 November 2022.

Paper submissions for Peer-Reviewed Technical Papers are due 13 June 2022.
All accepted Peer-Reviewed Technical Papers will be included in the proceedings (IEEE Xplore).


 IEEE International Conference on E-health Networking, Application & Services

HealthCom will be held 17-19 October 2022 // Genoa, Italy. HealthCom brings together experts from around the world working in the healthcare field to exchange ideas, discuss innovative and emerging solutions, and develop collaborations.

Authors are cordially invited to submit their original papers within the eHealth area.

IMPORTANT DATES

Paper Submission: 15 May 2022
Notification of Acceptance: 30 July 2022
Final Manuscript (Camera ready): 30 August 2022

SUBMISSION GUIDELINES

Paper submissions shall be done via EDAS system using this LINK.

Journal Special Issues Available!

The best conference papers will be selected to be published in Special Issues of the IEEE Internet of Things Journal and the ComSoc-sponsored Journal of Communications Software and Systems. Further details about the Call for Papers are available here.


 2022 IEEE 5th Future Networks World Forum (FNWF’22) 

A Comprehensive Look at 5G and Beyond 
12-14 October 2022, Montreal, Canada, with virtual option for authors

The 2022 IEEE 5th Future Networks World Forum (FNWF’22) — formerly the 5G World Forum — seeks contributions on how to nurture and cultivate future network technologies and applications through 5G and beyond for the betterment of society.

This will be an in-person event in Montreal, Canada, but authors of accepted conference papers may opt to present remotely. 

Deadlines and Contacts for Technical Program:

Paper Submission: 15 May 2022
Acceptance Notification: 30 July 2022
Camera-ready Submission: 31 August 2022
TPC-Chair, Essaid Sabir, essaid.sabir@ieee.org
TPC Co-Chair, Halima Elbiaze, elbiaze.halima@uqam.ca
TPC Co-Chair, Gunes Kurt, gunes.kurt@polymtl.ca
TPC Co-Chair, Walid Saad, walids@vt.edu
TPC Co-Chair, Francisco Falcone, francisco.falcone@unavarra.es
Symposiums Chair: Mithun Mukherjee, mithun.mukherjee@outlook.com


 GLOBECOM 2022

The 2022 IEEE Global Communications Conference (GLOBECOM 2022) will be held 4-8 December as a hybrid event. Presenters may choose to present their papers in person in Rio de Janeiro and/or virtually. Presenters must provide their choice of presentation format after their papers/presentations have been accepted.

Themed “Accelerating the Digital Transformation through Smart Communications,” this flagship conference of the IEEE Communications Society will feature a comprehensive high-quality technical program including 13 symposia and a variety of tutorials and workshops.

Symposium Paper Submissions: 15 April 2022 (23:59 EST) (FIRM)

Workshop Paper Submissions: 15 July 2022 


MEDITCOM

The 2nd Annual IEEE International Mediterranean Conference on Communications and Networking (MeditCom) will take place 5-8 September 2022 in Athens, Greece. 

Industry and academia experts are invited to submit papers on a wide range of research subjects, spanning both theoretical topics and system engineering.


 
Upcoming Events
You can see all of our upcoming events on the IEEE Denver Events Calendar

 

The IEEE Denver Section is comprised of over 3600 engineers and technical professionals in the Denver - Boulder area.
 
Mission Statement Enrich the professional and personal lives of the Rocky Mountain Region members, developing them into valued contributors to society through quality programs, continuing education, career development and community service; in collaboration with IEEE, industry, government and academia.
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