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DESCRIPTION:Speaker: Dr. Kamil Yavuz Kapusuz\n\nTitle：From Chip to System
 : A Holistic Approach to 2D Scalable Low-Loss D-Band Active Phased Array R
 ealization\n\nAbstract: The relentless demand for multi-gigabit wireless c
 ommunication and high-resolution sensing drives rapid innovation in D-band
  (110–170 GHz) systems. However\, realizing efficient and scalable activ
 e phased arrays at these frequencies remains challenging due to high cost\
 , interconnect losses\, packaging parasitics\, and heterogeneous integrati
 on constraints. This talk presents a holistic\, system-level approach to l
 ow-loss D-band phased array integration that unifies circuit\, antenna\, a
 nd packaging co-design. Leveraging both silicon-based (CMOS\, SiGe) and II
 I–V integrated circuits\, the approach emphasizes optimized beamformer a
 nd power amplifier architectures combined with low-cost 2D scalable\, wide
 -angle scanning wideband antenna arrays implemented using low-cost PCB pro
 cesses. Through electromagnetic co-optimization and advanced interconnect 
 engineering\, the framework achieves significant reduction in loss and imp
 rovement in overall system efficiency. Measured D-band results from protot
 ype modules demonstrate wide-angle beam steering and data transmission rat
 es up to 100 Gb/s. These results confirm the feasibility of steerable\, hi
 gh-capacity arrays suitable for both communication and sensing platforms.\
 n\nShort Bio: Kamil Yavuz Kapusuz (Senior Member\, IEEE) received the M.Sc
 . degree in Electrical Engineering from Atilim University\, Ankara\, Turke
 y\, in 2013\, and the Ph.D. degree in Electrical Engineering from the Elec
 tromagnetics Group\, Department of Information Technology\, Ghent Universi
 ty\, Belgium in 2021.\n\nFrom 2014 to 2016\, he worked as a Senior Antenna
  Engineer at Remote Sensing Technologies\, Turkey. Between 2021 and 2022\,
  he was a Visiting Scientist at the CNRS\, IETR Laboratory\, France. Since
  2022\, he has been a Senior Researcher in Electromagnetics at IMEC and Gh
 ent University. His research includes on the analysis and design of quasi-
 optical systems\, leaky-wave antennas\, near-field focusing techniques\, i
 n/on-body communication systems\, active/reconfigurable/unconventional mil
 limeter-wave and sub-terahertz phased arrays\, and electromagnetic modelin
 g and optimization of 2.5D and 3D RF packaging architectures.\n\nDr. Kapus
 uz received the URSI Young Scientist Award at the 2021 URSI General Assemb
 ly.\n\nTime: 2pm-3pm NST\, 1 December\, 2026\n\nWebinar Link: https://mun.
 webex.com/meet/weimin\n\nCo-sponsored by: IEEE AP-S YP Ambassador program\
 n\nSpeaker(s): Kamil Yavuz Kapusuz\, \n\nVirtual: https://events.vtools.ie
 ee.org/m/575870
LOCATION:Virtual: https://events.vtools.ieee.org/m/575870
ORGANIZER:weimin@mun.ca
SEQUENCE:33
SUMMARY:IEEE NL OES-GRSS-APS invited APS YP Talk
URL;VALUE=URI:https://events.vtools.ieee.org/m/575870
X-ALT-DESC:Description: <br /><p><span lang="EN-US"><strong data-olk-copy-s
 ource="MessageBody">Speaker:&nbsp\;</strong>Dr. <span style="font-size: 11
 .0pt\; line-height: 107%\; font-family: 'Aptos'\,sans-serif\; mso-ascii-th
 eme-font: minor-latin\; mso-fareast-font-family: Aptos\; mso-fareast-theme
 -font: minor-latin\; mso-hansi-theme-font: minor-latin\; mso-bidi-font-fam
 ily: 'Times New Roman'\; mso-bidi-theme-font: minor-bidi\; mso-ansi-langua
 ge: #1000\; mso-fareast-language: EN-US\; mso-bidi-language: AR-SA\;">Kami
 l Yavuz Kapusuz </span></span></p>\n<p><span lang="EN-US"><strong>Title：
 </strong></span>From Chip to System: A Holistic Approach to 2D Scalable Lo
 w-Loss D-Band Active Phased Array Realization</p>\n<p><span lang="EN-US"><
 strong>Abstract:</strong>&nbsp\;</span>The relentless demand for multi-gig
 abit wireless communication and high-resolution sensing drives rapid innov
 ation in D-band (110&ndash\;170 GHz) systems. However\, realizing efficien
 t and scalable active phased arrays at these frequencies remains challengi
 ng due to high cost\, interconnect losses\, packaging parasitics\, and het
 erogeneous integration constraints. This talk presents a holistic\, system
 -level approach to low-loss D-band phased array integration that unifies c
 ircuit\, antenna\, and packaging co-design. Leveraging both silicon-based 
 (CMOS\, SiGe) and III&ndash\;V integrated circuits\, the approach emphasiz
 es optimized beamformer and power amplifier architectures combined with lo
 w-cost 2D scalable\, wide-angle scanning wideband antenna arrays implement
 ed using low-cost PCB processes. Through electromagnetic co-optimization a
 nd advanced interconnect engineering\, the framework achieves significant 
 reduction in loss and improvement in overall system efficiency. Measured D
 -band results from prototype modules demonstrate wide-angle beam steering 
 and data transmission rates up to 100 Gb/s. These results confirm the feas
 ibility of steerable\, high-capacity arrays suitable for both communicatio
 n and sensing platforms<span lang="EN-US">.</span></p>\n<p><span lang="EN-
 US"><strong>Short Bio: </strong></span>Kamil Yavuz Kapusuz (Senior Member\
 , IEEE) received the M.Sc. degree in Electrical Engineering from Atilim Un
 iversity\, Ankara\, Turkey\, in 2013\, and the Ph.D. degree in Electrical 
 Engineering from the Electromagnetics Group\, Department of Information Te
 chnology\, Ghent University\, Belgium in 2021.</p>\n<p class="MsoNormal" s
 tyle="text-align: justify\;">From 2014 to 2016\, he worked as a Senior Ant
 enna Engineer at Remote Sensing Technologies\, Turkey. Between 2021 and 20
 22\, he was a Visiting Scientist at the CNRS\, IETR Laboratory\, France. S
 ince 2022\, he has been a Senior Researcher in Electromagnetics at IMEC an
 d Ghent University. His research includes on the analysis and design of qu
 asi-optical systems\, leaky-wave antennas\, near-field focusing techniques
 \, in/on-body communication systems\, active/reconfigurable/unconventional
  millimeter-wave and sub-terahertz phased arrays\, and electromagnetic mod
 eling and optimization of 2.5D and 3D RF packaging architectures.</p>\n<p 
 class="MsoNormal" style="text-align: justify\;">Dr. Kapusuz received the U
 RSI Young Scientist Award at the 2021 URSI General Assembly.</p>\n<p><span
  lang="EN-US"><strong>Time: 2</strong>pm-3pm NST\, 1 December\, 2026</span
 ></p>\n<p><span lang="EN-US"><strong>Webinar Link:</strong> <a id="LPlnkOW
 A28982fd1-65d1-46b4-9b66-c01db2eb5614" class="x_x_x_OWAAutoLink x_elementT
 oProof" title="https://mun.webex.com/meet/weimin" href="https://mun.webex.
 com/meet/weimin" data-auth="NotApplicable" data-olk-copy-source="MessageBo
 dy" data-linkindex="0">https://mun.<span class="marktrsywhkil" data-markjs
 ="true" data-ogac="" data-ogab="" data-ogsc="" data-ogsb="" data-ogsbtc=""
  data-ogsbrc="" data-ogsbbc="" data-ogsblc="">webex</span>.com/meet/weimin
 </a></span></p>
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