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DTSTART:20190216T230000
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DTSTAMP:20250413T140200Z
UID:37E63AF3-A8C1-4451-9A00-13CDCE66D715
DTSTART;TZID=America/Sao_Paulo:20250414T133000
DTEND;TZID=America/Sao_Paulo:20250414T150000
DESCRIPTION:Embedded HPC & Reliable Accelerator Integration in the AI Age b
 y Open EDA & Eco Systems\n\nIncreasing emerging fields towards reliable em
 bedded accelerator and processor integration\, incl. High-Performance Comp
 uting(HPC) systems\, are “essential and challenging forces” driving ac
 tual and future silicon technologies. This results in heterogenous multi-c
 ore (MC)\, various vector accelerator incl. artificial intelligence (AI) a
 nd networked cyber-physical systems (CPS) integration. Here\, on one side 
 increasing monolythic integration of cooperating computational and physica
 l sensor components is necessary\, e. g. in embedded and smart on-demand a
 utomatized environments as diverse as applied in communication/consumer\, 
 automotive/transportation\, avionics\, civil infrastructure\, energy\, hea
 lthcare\, manufacturing (Industry 4.0)\, and also space appliances. Moreov
 er\, future complex dynamically adaptive and multi-domain electronic syste
 m integration tends to be more and more dependent on distributed real-time
  and embedded HPC availability. This results in the strong demand of newly
  operating decentralized/centralized intelligent\, interconnected\, and si
 licon technology integrated solutions\, subject to increased performance n
 eeds to facilitate computationally intensive algorithms\, power consumptio
 n to be minimized\, as well as sufficient degrees of reliability and verif
 iability to employ digital systems in highly networked as well as safety-c
 ritical environments\, e. g. in future embedded\, incl.6G\, automotive etc
 . system integration\, driven by software-defined approaches. Existing tec
 hnologies must evolve in order to meet such scalable and high requirements
 \, whereas Open Source Hardware & Softwareincl. explainable AI-based compo
 nents will also play key roles in this actual dynamic development. Multipu
 rpose adaptivity\, connectivity and reliability are crucial\, especially i
 n scaling down silicon technologies according to “Extending Moore” for
  future processor technologies incl. dynamically reconfigurable and AI-dri
 ven accelerators. This requires new open EDA approaches with standardized 
 tool flows towards efficient heterogenous system integration. The talk wil
 l present important challenges of high-end heterogenous Multi-Core/Acceler
 ator HPC platforms by reliable SoC and SiPhardware/software integration wi
 th smart\, scalable\, reliable & embedded accelerator & processor solution
 s. This includes corresponding Global Ecosystem discussions in the presenc
 e of RISC-V\, national & European Chipact\, 6G and automotive initiatives 
 whereas necessary AI & chipdesign aspects have to be considered.\n\nThe ta
 lk will in addition sketch in this context some selected communication & a
 utomotive related project initiatives like Open6GHub (6G for Society and S
 ustainability - https://www.open6ghub.de/en/)\, EPI (European Processor In
 itiative - [https://www.european-processor-initiative.eu](https://www.euro
 pean-processor-initiative.eu/))\, XANDAR (Safety and Security for Embedded
  Software Systems - [https://xandar-project.eu](https://xandar-project.eu/
 ))\, ZuSE-KI-mobil (Platform for energy-efficient AI processors in mobile 
 applications - https://www.itiv.kit.edu/english/201_8016.php)\, and the na
 tional project CeCaS (CentralCarServer - https://www.itiv.kit.edu/english/
 201_8769.php)\, among others.\n\nCo-sponsored by: UFRGS\n\nSpeaker(s): Jur
 gen Becker\, \n\nBldg: 43413\, Av. Bento Gonçalves\, 9500 - UFRGS Campus 
 do Vale\, Auditório do Instituto de Informática\, Porto Alegre\, Rio Gra
 nde do Sul\, Brazil\, 91509-900
LOCATION:Bldg: 43413\, Av. Bento Gonçalves\, 9500 - UFRGS Campus do Vale\,
  Auditório do Instituto de Informática\, Porto Alegre\, Rio Grande do Su
 l\, Brazil\, 91509-900
ORGANIZER:grellert@ieee.org
SEQUENCE:8
SUMMARY:Embedded HPC & Reliable Accelerator Integration in the AI Age by Op
 en EDA & Eco Systems
URL;VALUE=URI:https://events.vtools.ieee.org/m/481098
X-ALT-DESC:Description: <br /><div>\n<div><strong>Embedded HPC &amp\; Relia
 ble Accelerator Integration in the AI Age by Open EDA &amp\; Eco Systems</
 strong></div>\n</div>\n<div><strong>&nbsp\;</strong></div>\n<div>\n<div><s
 pan lang="EN-US">Increasing emerging fields towards reliable embedded acce
 lerator and processor integration\, incl.&nbsp\;<em>High-Performance Compu
 ting</em>(HPC)<em>&nbsp\;</em>systems\, are &ldquo\;essential and challeng
 ing forces&rdquo\; driving actual and future silicon technologies. This re
 sults in heterogenous&nbsp\;<em>multi-core</em>&nbsp\;(MC)\, various vecto
 r accelerator incl.<em>&nbsp\;artificial intelligence&nbsp\;</em>(AI) and 
 networked&nbsp\;<em>cyber-physical systems</em>&nbsp\;(CPS) integration. H
 ere\, on one side increasing monolythic integration of cooperating computa
 tional and physical sensor components is necessary\, e. g. in embedded and
  smart&nbsp\;<em>on-demand</em>&nbsp\;automatized environments as diverse 
 as applied in communication/consumer\, automotive/transportation\, avionic
 s\, civil infrastructure\, energy\, healthcare\, manufacturing (<em>Indust
 ry 4.0</em>)\, and also space appliances. Moreover\, future complex dynami
 cally adaptive and multi-domain electronic system integration tends to be 
 more and more dependent on distributed real-time and&nbsp\;<em>embedded HP
 C&nbsp\;</em>availability. This results in the strong demand of newly oper
 ating decentralized/centralized intelligent\, interconnected\, and silicon
  technology integrated solutions\, subject to increased performance needs<
 strong>&nbsp\;</strong>to facilitate computationally intensive algorithms\
 , power consumption<strong>&nbsp\;</strong>to be minimized\, as well as su
 fficient degrees of reliability and verifiability to employ digital system
 s in highly networked as well as safety-critical environments\, e. g. in f
 uture embedded\, incl.6G\, automotive etc. system integration\, driven by 
 software-defined approaches.&nbsp\;</span><span lang="EN-US">Existing tech
 nologies must evolve in order to meet such scalable and high requirements\
 , whereas&nbsp\;<em>Open Source Hardware</em><strong>&nbsp\;</strong>&amp\
 ;&nbsp\;<em>Software</em>incl.<strong>&nbsp\;</strong>explainable AI-based
  components will<strong>&nbsp\;</strong>also<strong>&nbsp\;</strong>play<s
 trong>&nbsp\;</strong>key roles in this actual dynamic development. Multip
 urpose adaptivity\, connectivity and reliability are crucial\, especially 
 in scaling down silicon technologies according to &ldquo\;<em>Extending Mo
 ore</em>&rdquo\; for future processor technologies incl. dynamically recon
 figurable and AI-driven accelerators. This requires&nbsp\;</span><span lan
 g="EN-GB">new open EDA approaches with standardized tool flows towards eff
 icient heterogenous system integration. &nbsp\;</span>The talk will presen
 t important challenges of high-end heterogenous&nbsp\;<em>Multi-Core/Accel
 erator<strong>&nbsp\;</strong>HPC<strong>&nbsp\;</strong></em>platforms by
 &nbsp\;<em>reliable SoC</em>&nbsp\;and&nbsp\;<em>SiP</em>hardware/software
  integration with smart\, scalable\, reliable &amp\; embedded accelerator 
 &amp\; processor solutions. This includes corresponding&nbsp\;<em>Global E
 cosystem</em>&nbsp\;discussions in the presence of&nbsp\;<em>RISC-V</em>\,
  national &amp\;&nbsp\;<em>European Chipact</em>\,&nbsp\;<em>6G</em>&nbsp\
 ;and&nbsp\;<em>automotive</em>&nbsp\;initiatives whereas necessary AI &amp
 \; chipdesign aspects have to be considered.&nbsp\;</div>\n<div>&nbsp\;</d
 iv>\n<div>The talk will in addition sketch in this context some selected&n
 bsp\;<em>communication</em>&nbsp\;&amp\;&nbsp\;<em>automotive</em>&nbsp\;r
 elated project initiatives like&nbsp\;<strong><em>Open6GHub</em></strong>&
 nbsp\;(<em>6G for Society and Sustainability&nbsp\;</em>-&nbsp\;<a href="h
 ttps://www.open6ghub.de/en/">https://www.open6ghub.de/en/</a>)\,&nbsp\;<st
 rong><em>EPI</em></strong>&nbsp\;(<em>European Processor Initiative -&nbsp
 \;<a href="https://www.european-processor-initiative.eu/">https://www.euro
 pean-processor-initiative.eu</a></em>)\,&nbsp\;<strong><em>XANDAR</em></st
 rong>&nbsp\;(<em>Safety and Security for Embedded Software Systems -&nbsp\
 ;<a href="https://xandar-project.eu/">https://xandar-project.eu</a></em>)\
 ,&nbsp\;<strong><em>ZuSE-KI-mobil</em></strong>&nbsp\;(Platform for energy
 -efficient AI processors in mobile applications -&nbsp\;<a href="https://w
 ww.itiv.kit.edu/english/201_8016.php">https://www.itiv.kit.edu/english/201
 _8016.php</a>)\, and the national project&nbsp\;<strong><em>CeCaS</em></st
 rong>&nbsp\;(<em>CentralCarServer</em>&nbsp\;-&nbsp\;<a href="https://www.
 itiv.kit.edu/english/201_8769.php">https://www.itiv.kit.edu/english/201_87
 69.php</a>)\, among others.</div>\n</div>
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