June IEEE-Madison ECN Meeting: "Packaging SoCs"

• Thursday, June 20th, 11:30AM - 1:00 PM
• Meet and Greet and BYO Lunch first
• Talk by Tom Kaminski followed by open discussion
• Location:  
      Sector67, 56 Cory Street, Madison, 53704

• Please Register at the IEEE-Madison  event page.

Title: "Packaging SoCs"

Talk: Inexpensive System-On-a-Chip devices have radically changed the application of digital processing to common problems. The Raspberry Pi has now become the third most prevalent general purpose computer (after the PC and Apple devices) in the world. It can also be used to implement instruments and serve as a system integration device. Several packaging and powering options will be shown including, wall-warts, SoC Blades, Power-Over-Ethernet (PoE), Fake PoE and battery powered options.  Bring your preferred solutions to the discussion.

Speaker: Tom Kaminski is a retired instructor of Automation from Madison College. He has been working on using SoCs to solve system integration problems for years and has several products using SoCs under development, including a Sonic Boom recorder for use by NASA, a Community Noise Monitor, and a Light-Rail Ride Quality device.