Special : "American Solar Prize Networking Meetup"

• Thursday, June 17th, 7:00 PM
• Talk and Networking Meeting
• Talk by Heather Allen, Program Director at RENEW Wisconsin
  
• Open Discussion of Issues
• Taste a Solar Cooked Hot Dog!
• Location:  
      Sector67, 56 Cory Street, Madison, 53704

Are you involved in the Solar Industry? Have you thought about Solar limitations? Do you have ideas on how to advance Solar Technology, or do you have insights to the limiting technologies for Solar? If so, come join with people interested in advancing Solar Technology at a connector event for the American-Made Solar Prize at Sector67.  Stop in for a discussion on solar power by Heather Allen, meet with others, hear about existing challenges and future advances in the field. Then contribute to the open discussions and join with potential team mates.

$3,000,000 in prize money is available through the contest, which is open to any competitor – the submission deadline is coming up on July 16th, 2PM E.T. First round winners (20-40 submissions chosen) receive up to $50,000 in prize money to work forward on their idea for further submissions with subsequent rounds featuring $200,000 and $500,000 in prize money allocated to winners.

YOU can participate to win a $1,000 award just for identifying industry areas that can use attention from entrants by July 5th.

The submission form is available on the contest entry website in the resources tab, linked directly here for convenience. Effectively you need to prepare a 2500 word maximum statement, a 90 second video (with no production value efforts), and some team information to create an entry for a shot at $50,000 in prize money.

June IEEE-Madison ECN Meeting: "Packaging SoCs"

• Thursday, June 20th, 11:30AM - 1:00 PM
• Meet and Greet and BYO Lunch first
• Talk by Tom Kaminski followed by open discussion
• Location:  
      Sector67, 56 Cory Street, Madison, 53704

• Please Register at the IEEE-Madison  event page.

Title: "Packaging SoCs"

Talk: Inexpensive System-On-a-Chip devices have radically changed the application of digital processing to common problems. The Raspberry Pi has now become the third most prevalent general purpose computer (after the PC and Apple devices) in the world. It can also be used to implement instruments and serve as a system integration device. Several packaging and powering options will be shown including, wall-warts, SoC Blades, Power-Over-Ethernet (PoE), Fake PoE and battery powered options.  Bring your preferred solutions to the discussion.

Speaker: Tom Kaminski is a retired instructor of Automation from Madison College. He has been working on using SoCs to solve system integration problems for years and has several products using SoCs under development, including a Sonic Boom recorder for use by NASA, a Community Noise Monitor, and a Light-Rail Ride Quality device.